The Structural Packaging Summit will offer an enriching experience to explore the latest tools, trends, issues, and technologies integral to the package development process and support the creation of new packaging that best fits the needs of consumers and clients. Formerly the Package Design and Development Summit, the name of this event has changed to better reflect the focus on creation and development of the package, and the connection to its success. Join us to hear prominent structural designers, key package innovators, top brand owners, and other package development professionals discuss the work behind key packaged brands and how the packaging industry can discover opportunities for the further introduction of new package formats and materials. Among the key companies on this year's agenda: Dr Pepper Snapple Group, Schwan's Food, Energizer Battery, H.J.Heinz and General Mills. They, along with leading package designers such as Webb deVlam and Kaleidoscope and development trendsetters such as Clemson University's Institute of Package Design and Graphics, will offer you the tools to succeed. Plan now to attend!